Technical Terms Glossary

Axis (X, Y, Z):

The three-dimensional coordinates used in the software to position and orient the crystal. The X-axis is horizontal, the Y-axis is vertical, and the Z-axis indicates depth.

Core Offset:

The deviation or adjustment made to the core’s position during the cutting process. This can affect the yield of good wafers from the crystal.

Coring:

The process of cutting cylindrical sections from the crystal for further processing, similar to wafering but typically creating larger, core-shaped pieces.

Crystal Defects:

Imperfections or irregularities within the crystal structure that can affect the quality of the final product. The software identifies and grades these defects for more informed decision-making during the coring or wafering processes.

Day Shift:

Part of CNC code for a coring or wafering system, which refers to the work that requires machine operators’ assistance, such as drilling the last few mm of cores.

Defect Grading:

A process that ranks defects based on their impact on the quality of the final product, helping users prioritize which defects to address.

Loading Dialog Box:

A pop-up window that appears when the system is processing a computation, like when calculating the wafer yield. It informs the user that the system is working and how long the process might take.

Model:

A digital representation of a crystal created from scan data, which can be explored, analyzed, and modified within the software.

Night Shift:

Part of CNC code, which refers to the work period that can be done autonomously by the machine with no operator assistance.

Preferred View:

The main view that displays the largest window in the interface, which can be customized in the Settings menu. This view gives the user a primary workspace for examining models.

SVCI (Scientific Visual Crystal Image):

The raw data file format generated by Scientific Visual scanners for 2D visualization.

SVCI files:

Raw data files from the scanner.

SVCM (Scientific Visual Crystal Model):

The file format used by Scientific Visual for 3D models of crystals.

Toolbar:

A section of the software interface that provides easy access to frequently used functions, such as opening models, rotating views, and adjusting settings.

TUA/TUV:

Technical parameters related to wafer thickness, used in the analysis and planning of wafer production.

Wafering:

The process of slicing a crystal into thin, flat pieces called wafers, which are commonly used in the production of electronics.

Yield:

The number of good (non-defective) wafers that can be produced from a single crystal. The software computes this based on your input parameters, helping you maximize production efficiency.