Wafering Tab

Wafering

The Wafering Tab in Yield is designed for creating and managing wafer slices from a crystal model. It offers several methods for wafer creation, including automatic and manual modes, and provides detailed options to fine-tune the wafering process for various crystal shapes and defect parameters.

Wafering Options

The Wafering Tab includes five main wafering methods, each suited for different crystal shapes and slicing needs:

  • Wafer: Creates regular cylindrical wafers, ideal for standard-shaped crystals with uniform geometry.

  • Smart Wafer: Automatically adjusts the wafering to maximize usable material while avoiding defects. It takes into account both the crystal shape and defect distribution to optimize the process.

  • FreeZone: Defines wafering zones based on minimum thickness and calculates the total amount of good material that can be obtained from the crystal. This option is best for crystals with irregular shapes or inconsistent material quality.

  • Slicing: Allows the creation of slices in any shape or form, not limited to cylindrical wafers. This mode is particularly useful for uniquely shaped crystals where standard cylindrical slicing is not practical.

  • SlicingZone: Similar to the FreeZone option, but specifically optimized for irregular-shaped crystals. It defines zones for slicing based on the material quality and shape of the crystal to minimize waste.

Wafer Parameters

Once a wafering method is selected, you can configure additional parameters:

  • Axis: Defines the axis along which the wafering will occur, allowing precise control over slice orientation.

  • Thickness: Adjusts the thickness of each wafer in millimeters.

  • Defects Parameters: Customize defect tolerance, ensuring that only usable material is sliced. Choose between Only visible or All.

Compute Yield

After configuring the wafering options, click the Compute Yield button to generate a detailed analysis of the wafering process. A window below will display computation results, including the number of usable wafers, defect distribution, and overall material efficiency.

Wafer Details Section

The Wafer Details Section provides a list of all created wafers, with key information for each:

  • Core: The core number or label for reference.

  • Wafer: The specific wafer number in the sequence.

  • Color: The assigned color for the wafer in the visual model.

  • TUA: Top usable area – the amount of usable material at the top of the wafer.

  • TUV: Top usable volume – the volume of usable material at the top of the wafer.

  • Thickness: The thickness of each wafer.

Visibility and Selection Checkboxes

To control wafer visibility and selection, the Wafering Tab includes the following checkboxes:

  • TUA: Shows or hides the top usable area for each wafer.

  • TUV: Shows or hides the top usable volume for each wafer.

  • Def. Yield: Displays the defect yield for each wafer.

  • Bottom: Toggles visibility of the wafer bottom.

  • Top: Toggles visibility of the wafer top.

Action Buttons

  • Toggle Good: Highlights wafers that have a high yield of usable material.

  • Toggle Bad: Highlights wafers that are considered unusable due to defects or insufficient material.

  • Toggle Misfit: Highlights wafers that don’t meet the specified criteria for usability but may still contain usable material.

  • Toggle Labels: Shows or hides the labels for each wafer, making it easier to identify them in the 3D view.

  • Hide/Show Selected: Hides or displays the currently selected wafers in the main window.

  • Delete Selected: Permanently deletes the selected wafers from the model. This action cannot be undone, so it should be used with caution.

The Wafering Tab provides powerful tools to manage wafer slicing with precision, taking into account both material quality and crystal shape. By using options like Smart Wafering and Slicing Zone, users can optimize their yield and minimize waste, ensuring the most efficient use of their crystal material.

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